For a silicon chip or integrated circuit to function, it needs to be
connected to the system that it will control or provide instruction to.
Integrated circuit assembly will provide connection of the integrated
circuit for power and information transfer between the chip and the
system.
This is accomplished by connecting the chip to a package or direct connection to the printed circuit for these functions. Connections between the
chip and the package or printed circuit board are via wire bonding or flip chip assembly. Liat Electronics’ expertise, technologies and gas supply advantages
can provide improved profits, uptime, defect reduction, and improvement in the total cost of ownership for your integrated circuit board assembly and test
processes.
This is accomplished by connecting the chip to a package or direct connection to the printed circuit for these functions. Connections between the
chip and the package or printed circuit board are via wire bonding or flip chip assembly. Liat Electronics’ expertise, technologies and gas supply advantages
can provide improved profits, uptime, defect reduction, and improvement in the total cost of ownership for your integrated circuit board assembly and test
processes.
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